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AP10H03S 10A 30V SOP-8 Mosfet Power Transistor Vertical Structure

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AP10H03S 10A 30V SOP-8 Mosfet Power Transistor Vertical Structure

AP10H03S 10A 30V SOP-8 Mosfet Power Transistor Vertical Structure
AP10H03S 10A 30V SOP-8 Mosfet Power Transistor Vertical Structure AP10H03S 10A 30V SOP-8 Mosfet Power Transistor Vertical Structure AP10H03S 10A 30V SOP-8 Mosfet Power Transistor Vertical Structure

Large Image :  AP10H03S 10A 30V SOP-8 Mosfet Power Transistor Vertical Structure

Product Details:
Place of Origin: ShenZhen China
Brand Name: Hua Xuan Yang
Certification: RoHS、SGS
Model Number: AP10H03S
Payment & Shipping Terms:
Minimum Order Quantity: Negotiation
Price: Negotiated
Packaging Details: Boxed
Delivery Time: 1 - 2 Weeks
Payment Terms: L/C T/T Western Union
Supply Ability: 18,000,000PCS / Per Day

AP10H03S 10A 30V SOP-8 Mosfet Power Transistor Vertical Structure

Description
Product Name: Mosfet Power Transistor Model: AP10H03S
Pack: SOP-8 Marking: AP10H03S XXX YYYY
VDSDrain-Source Voltage: 30V VGSGate-Sou Rce Voltage: ±20A
High Light:

n channel mosfet transistor

,

high voltage transistor

AP10H03S 10A 30V SOP-8 Mosfet Power Transistor Vertical Structure

 

Mosfet Power Transistor Description:

 

The AP10H03S is the highest performance trench
N-ch MOSFETs with extreme high cell density,
which provide excellent RDSON and gate charge
for most of the small power switching and
load switch applications. The meet the RoHS and
Product requirement with full function reliability approved.

 

Mosfet Power Transistor Features

 

VDS = 30V ID = 10A
RDS(ON) < 12mΩ @ VGS=4.5V
RDS(ON) < 16.5mΩ @ VGS=2.5V

 

Mosfet Power Transistor Application

 

Battery protection
Load switch
Uninterruptible power supply

 

Package Marking and Ordering Information

 

Product ID Pack Marking Qty(PCS)
AP10H03S SOP-8 AP10H03S XXX YYYY 3000

 

Absolute Maximum Ratings (TA=25unless otherwise noted)

 

 

Symbol Parameter Rating Units
VDS Drain-Source Voltage 30 V
VGS Gate-Source Voltage ±20 V
ID@TC=25℃ Continuous Drain Current, V GS @ 10V 1 10 A
ID@TC=100 ℃ Continuous Drain Current, V GS @ 10V 1 8.2 A
ID@TA=25℃ Continuous Drain Current, VGS @ 10V1 9.5 A
ID@TA=70℃ Continuous Drain Current, V GS @ 10V 1 7.6 A
IDM Pulsed Drain Current2 75 A
EAS Single Pulse Avalanche Energy 3 24.2 mJ
IAS Avalanche Current 22 A
PD@TC=25 ℃ Total Power Dissipation4 26 W
PD@TA=25 ℃ Total Power Dissipation4 1.67 W
TSTG Storage Temperature Range -55 to 150
TJ Operating Junction Temperature Range -55 to 150
RθJA Thermal Resistance Junction-Ambient 1 75 ℃/W
RθJC Thermal Resistance Junction-Case 1 4.8 ℃/W

 

Electrical Characteristics (TJ=25, unless otherwise noted)

 

Symbol Parameter Conditions Min. Typ. Max. Unit
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 30 --- --- V
△BVDSS / T J BVDSS Temperature Coefficient Reference to 25℃ , ID=1mA --- 0.023 --- V/℃
RDS(ON) Static Drain-Source On-Resistance VGS=10V , I D=15A --- --- 12

 

VGS=4.5V , I D=10A --- --- 16.5
VGS(th) Gate Threshold Voltage

 

VGS=VDS , ID =250uA

1.0 --- 2.5 V
△VGS(th) VGS(th) Temperature Coefficient --- -5.08 --- mV/℃

 

IDSS

 

Drain-Source Leakage Current

VDS=24V , VGS=0V , TJ=25℃ --- --- 1

 

uA

VDS=24V , VGS=0V , TJ=55℃ --- --- 5
IGSS Gate-Source Leakage Current VGS=±20V , V DS=0V --- --- ±100 nA
gfs Forward Transconductance VDS=5V , ID=15A --- 24.4 --- S
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz --- 1.8 --- Ω
Qg Total Gate Charge (4.5V) VDS=15V , VGS=4.5V , ID=12A --- 9.82 ---  
Qgs Gate-Source Charge --- 2.24 ---
Qgd Gate-Drain Charge --- 5.54 ---
Td(on) Turn-On Delay Time VDD=15V , VGS=10V , RG=1.5
ID=20A
--- 6.4 ---  
Tr Rise Time --- 39 ---
Td(off) Turn-Off Delay Time --- 21 ---
Tf Fall Time --- 4.7 ---
Ciss Input Capacitance VDS=15V , VGS=0V , f=1MHz --- 896 ---  
Coss Output Capacitance --- 126 ---
Crss Reverse Transfer Capacitance --- 108 ---
IS Continuous Source Current 1,5

 

VG=VD=0V , Force Current

--- --- 37 A
ISM Pulsed Source Current2,5 --- --- 75 A
VSD Diode Forward Voltage2 VGS=0V , IS=1A , TJ=25℃ --- --- 1 V
Symbol Parameter Conditions Min. Typ. Max. Unit
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 30 --- --- V
△BVDSS / T J BVDSS Temperature Coefficient Reference to 25℃ , ID=1mA --- 0.023 --- V/℃
RDS(ON) Static Drain-Source On-Resistance VGS=10V , I D=15A --- --- 12

 

VGS=4.5V , I D=10A --- --- 16.5
VGS(th) Gate Threshold Voltage

 

VGS=VDS , ID =250uA

1.0 --- 2.5 V
△VGS(th) VGS(th) Temperature Coefficient --- -5.08 --- mV/℃

 

IDSS

 

Drain-Source Leakage Current

VDS=24V , VGS=0V , TJ=25℃ --- --- 1

 

uA

VDS=24V , VGS=0V , TJ=55℃ --- --- 5
IGSS Gate-Source Leakage Current VGS=±20V , V DS=0V --- --- ±100 nA
gfs Forward Transconductance VDS=5V , ID=15A --- 24.4 --- S
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz --- 1.8 --- Ω
Qg Total Gate Charge (4.5V)   --- 9.82 ---  
Qgs Gate-Source Charge --- 2.24 ---
Qgd Gate-Drain Charge --- 5.54 ---
Td(on) Turn-On Delay Time   --- 6.4 ---  
Tr Rise Time --- 39 ---
Td(off) Turn-Off Delay Time --- 21 ---
Tf Fall Time --- 4.7 ---
Ciss Input Capacitance   --- 896 ---  
Coss Output Capacitance --- 126 ---
Crss Reverse Transfer Capacitance --- 108 ---
IS Continuous Source Current 1,5

 

VG=VD=0V , Force Current

--- --- 37 A
ISM Pulsed Source Current2,5 --- --- 75 A
VSD Diode Forward Voltage2 VGS=0V , IS=1A , TJ=25℃ --- --- 1 V

 

Note :

1. The data tested by surface mounted on a 1 inch FR-4 board with 2OZ copper.

2. The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦2%

3 . The EAS data shows Max. rating . The test condition is VDD=25V,VGS=10V,L=0.1mH,IAS=22A

4. The power dissipation is limited by 175℃ junction temperature

5. The data is theoretically the same as I D and IDM , in real applications , should be limited by total power dissipation.

 

Attention

 

1, Any and all APM Microelectronics products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your APM Microelectronics representative nearest you before using any APM Microelectronics products described or contained herein in such applications.

2, APM Microelectronics assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all APM Microelectronics products described or contained herein.

3, Specifications of any and all APM Microelectronics products described or contained here instipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’s products or equipment.

4, APM Microelectronics Semiconductor CO., LTD. strives to supply high quality high reliability products. However, any and all semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives that could give rise to smoke or fire, or that could cause damage to other property. Whendesigning equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design,and structural design.

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7, Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for volume production. APM Microelectronics believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties.

8, Any and all information described or contained herein are subject to change without notice due to product/technology improvement,etc. When designing equipment, refer to the "Delivery Specification" for the APM Microelectronics product that you Intend to use.

 

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