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AP10H06S N Channel Mos Field Effect Transistor High Frequency

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AP10H06S N Channel Mos Field Effect Transistor High Frequency

AP10H06S N Channel Mos Field Effect Transistor High Frequency
AP10H06S N Channel Mos Field Effect Transistor High Frequency AP10H06S N Channel Mos Field Effect Transistor High Frequency AP10H06S N Channel Mos Field Effect Transistor High Frequency

Large Image :  AP10H06S N Channel Mos Field Effect Transistor High Frequency

Product Details:
Place of Origin: ShenZhen China
Brand Name: Hua Xuan Yang
Certification: RoHS、SGS
Model Number: AP10H06S
Payment & Shipping Terms:
Minimum Order Quantity: Negotiation
Price: Negotiated
Packaging Details: Boxed
Delivery Time: 1 - 2 Weeks
Payment Terms: L/C T/T Western Union
Supply Ability: 18,000,000PCS / Per Day

AP10H06S N Channel Mos Field Effect Transistor High Frequency

Description
Product Name: N Channel Mos Field Effect Transistor Model: AP10H06S
Pack: SOP-8 Marking: AP10H06S
VDSDrain-Source Voltage: 60V VGSGate-Sou Rce Voltage: ±20A
High Light:

n channel mosfet transistor

,

high voltage transistor

AP10H06S N Channel Mos Field Effect Transistor High Frequency

 

N Channel Mos Field Effect Transistor types

 

Within the overall arena of power MOSFETs, there are a number of specific technologies that have been developed and addressed by different manufacturers. They use a number of different techniques that enable the power MOSFETs to carry the current and handle the power levels more efficiently. As already mentioned they often incorporate a form of vertical structure

The different types of power MOSFET have different attributes and therefore can be particularly suited for given applications.

  • Planar power MOSFET: This is the basic form of power MOSFET. It is good for high voltage ratings because the ON resistance is dominated by the epi-layer resistance. This structure is generally used when a high cell density is not needed.
  • VMOS: VMOS power MOSFETs have been available for many years. The basic concept uses a V groove structure to enable a more vertical flow of the current, thereby providing lower ON resistance levels and better switching characteristics. Although used for power switching, they may also be used for high frequency small RF power amplifiers.
  • UMOS: The UMOS version of the power MOSFET uses a grove similar to that the VMOS FET. However the grove has a flatter bottom to it and provides some different advantages.
  • HEXFET: This form of power MOSFET uses a hexagonal structure to provide the current capability.
  • TrenchMOS: Again the TrenchMOS power MOSFET uses a similar basic grove or trench in the basic silicon to provide better handling capacity and characteristics. In particular, Trench power MOSFETs are mainly used for voltages above 200 volts because of their channel density and hence their lower ON resistance.

 

N Channel Mos Field Effect Transistor Features

 

VDS = 60V ID =10A
RDS(ON) < 20mΩ @ VGS=10V

 

N Channel Mos Field Effect Transistor Application

 

Battery protection
Load switch
Uninterruptible power supply

 

Package Marking and Ordering Information

 

Product ID Pack Marking Qty(PCS)
AP10H06S SOP-8 AP10H06S 3000

 

Absolute Maximum Ratings (TC=25unless otherwise noted)

 

Parameter Symbol Limit Unit
Drain-Source Voltage VDS 60 V
Gate-Source Voltage VGS ±20 V
Drain Current-Continuous ID 10 A
Drain Current-Continuous(TC=100 ℃) ID (100 ℃) 5.6 A
Pulsed Drain Current IDM 32 A
Maximum Power Dissipation PD 2.1 W
Operating Junction and Storage Temperature Range T J ,T STG -55 To 150
Thermal Resistance,Junction-to-Ambient (Note 2) RθJA 60 ℃/W

 

Electrical Characteristics (TC=25unless otherwise noted)

 

Parameter Symbol Condition Min Typ Max Unit
Drain-Source Breakdown Voltage BV DSS V GS=0V ID=250μA 60   - V
Zero Gate Voltage Drain Current IDSS V DS=60V,V GS=0V - - 1 μA
Gate-Body Leakage Current IGSS V GS=±20V,VDS=0V - - ±100 nA
Gate Threshold Voltage V GS(th) V DS=V GS,ID=250 μA 1.0 1.6 2.2 V

 

Drain-Source On-State Resistance

 

RDS(ON)

V GS=10V, ID=8A - 15.6 20 mΩ
V GS=4.5V, ID=8A - 20 28 mΩ
Forward Transconductance gFS V DS=5V,ID=8A 18 - - S
Input Capacitance Clss

 

V DS=30V,V GS=0V, F=1.0MHz

- 1600 - PF
Output Capacitance Coss - 112 - PF
Reverse Transfer Capacitance Crss - 98 - PF
Turn-on Delay Time td(on)   - 7 - nS
Turn-on Rise Time

r

t

- 5.5 - nS
Turn-Off Delay Time td(off) - 29 - nS
Turn-Off Fall Time

f

t

- 4.5 - nS
Total Gate Charge Qg

 

V DS=30V,ID=8A, V GS=10V

- 38.5 - nC
Gate-Source Charge Qgs - 4.7 - nC
Gate-Drain Charge Qgd - 10.3 - nC
Diode Forward Voltage (Note 3) V SD V GS=0V,IS=8A - - 1.2 V
Diode Forward Current (Note 2) IS - - - 8 A
Reverse Recovery Time

rr

t

TJ = 25°C, IF =8A

di/dt = 100A/ μs

- 28 - nS
Reverse Recovery Charge Qrr - 40 - nC
Parameter Symbol Condition Min Typ Max Unit
Drain-Source Breakdown Voltage BV DSS V GS=0V ID=250μA 60   - V
Zero Gate Voltage Drain Current IDSS V DS=60V,V GS=0V - - 1 μA
Gate-Body Leakage Current IGSS V GS=±20V,VDS=0V - - ±100 nA
Gate Threshold Voltage V GS(th) V DS=V GS,ID=250 μA 1.0 1.6 2.2 V

 

Drain-Source On-State Resistance

 

RDS(ON)

V GS=10V, ID=8A - 15.6 20 mΩ
V GS=4.5V, ID=8A - 20 28 mΩ
Forward Transconductance gFS V DS=5V,ID=8A 18 - - S
Input Capacitance Clss

 

V DS=30V,V GS=0V, F=1.0MHz

- 1600 - PF
Output Capacitance Coss - 112 - PF
Reverse Transfer Capacitance Crss - 98 - PF
Turn-on Delay Time td(on)   - 7 - nS
Turn-on Rise Time

r

t

- 5.5 - nS
Turn-Off Delay Time td(off) - 29 - nS
Turn-Off Fall Time

f

t

- 4.5 - nS
Total Gate Charge Qg

 

V DS=30V,ID=8A, V GS=10V

- 38.5 - nC
Gate-Source Charge Qgs - 4.7 - nC
Gate-Drain Charge Qgd - 10.3 - nC
Diode Forward Voltage (Note 3) V SD V GS=0V,IS=8A - - 1.2 V
Diode Forward Current (Note 2) IS - - - 8 A
Reverse Recovery Time

rr

t

TJ = 25°C, IF =8A

di/dt = 100A/ μs

- 28 - nS
Reverse Recovery Charge Qrr - 40 - nC

 

Note

 

1. Repetitive Rating: Pulse width limited by maximum junction temperature.

2. Surface Mounted on FR4 Board, t ≤ 10 sec.

3. Pulse Test: Pulse Width ≤ 300 μs, Duty Cycle ≤ 2%.

4. Guaranteed by design, not subject to production

 

Attention

 

1, Any and all APM Microelectronics products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your APM Microelectronics representative nearest you before using any APM Microelectronics products described or contained herein in such applications.

2, APM Microelectronics assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all APM Microelectronics products described or contained herein.

3, Specifications of any and all APM Microelectronics products described or contained here instipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’s products or equipment.

4, APM Microelectronics Semiconductor CO., LTD. strives to supply high quality high reliability products. However, any and all semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives that could give rise to smoke or fire, or that could cause damage to other property. Whendesigning equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design,and structural design.

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